The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Dec. 06, 2023
Applicant:
The Boeing Company, Arlington, VA (US);
Inventors:
George E. Bible, Chesterfield, MO (US);
Peter M. Winzek, Clayton, MO (US);
Assignee:
The Boeing Company, Arlington, VA (US);
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/54 (2006.01);
U.S. Cl.
CPC ...
B29C 70/545 (2013.01); B29C 2793/0054 (2013.01); B29C 2793/0081 (2013.01);
Abstract
A method for preparing a bond assembly jig (BAJ) includes forming a cutter relief groove in the BAJ, filling the cutter relief groove of the BAJ with a material, and curing the material after said filling.
Quick Actions:
Bible, George. (2026). Bond assembly jig preparation methods using thermosetting bismaleimide resins (U.S. Patent No. 12521946). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12521946
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile