The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Feb. 15, 2022
Applicant:

Xerox Corporation, Norwalk, CT (US);

Inventors:

Sarah J. Vella, Milton, CA;

Yujie Zhu, Mississauga, CA;

Assignee:

Xerox Corporation, Norwalk, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/118 (2017.01); B29C 48/05 (2019.01); B29C 64/10 (2017.01); B29C 64/165 (2017.01); B29C 64/314 (2017.01); B33Y 10/00 (2015.01); B33Y 40/10 (2020.01); B33Y 70/10 (2020.01); C08L 23/06 (2006.01); C08L 25/06 (2006.01); C08L 53/00 (2006.01); C08L 53/02 (2006.01); C08L 67/04 (2006.01); C08L 71/02 (2006.01); H10N 30/092 (2023.01); H10N 30/85 (2023.01); B29K 23/00 (2006.01); B29K 25/00 (2006.01); B29K 33/00 (2006.01); B29K 67/00 (2006.01); B29K 101/12 (2006.01); B29K 105/00 (2006.01); B29K 105/04 (2006.01); B29K 105/16 (2006.01); B29K 505/08 (2006.01); B29K 507/04 (2006.01); B29K 509/00 (2006.01); B29K 509/02 (2006.01); C08K 3/04 (2006.01); C08K 3/22 (2006.01); C08K 7/06 (2006.01); C08K 9/04 (2006.01);
U.S. Cl.
CPC ...
B29C 64/118 (2017.08); B29C 48/05 (2019.02); B29C 64/10 (2017.08); B29C 64/165 (2017.08); B29C 64/314 (2017.08); B33Y 10/00 (2014.12); B33Y 40/10 (2020.01); B33Y 70/10 (2020.01); C08L 23/06 (2013.01); C08L 25/06 (2013.01); C08L 53/005 (2013.01); C08L 53/02 (2013.01); C08L 67/04 (2013.01); C08L 71/02 (2013.01); H10N 30/092 (2023.02); H10N 30/852 (2023.02); B29K 2023/18 (2013.01); B29K 2025/08 (2013.01); B29K 2033/08 (2013.01); B29K 2033/12 (2013.01); B29K 2067/00 (2013.01); B29K 2067/04 (2013.01); B29K 2101/12 (2013.01); B29K 2105/002 (2013.01); B29K 2105/0023 (2013.01); B29K 2105/0085 (2013.01); B29K 2105/0088 (2013.01); B29K 2105/04 (2013.01); B29K 2105/16 (2013.01); B29K 2105/162 (2013.01); B29K 2505/08 (2013.01); B29K 2507/04 (2013.01); B29K 2509/00 (2013.01); B29K 2509/02 (2013.01); B29K 2995/0003 (2013.01); B29K 2995/0005 (2013.01); B29K 2995/0077 (2013.01); C08K 3/04 (2013.01); C08K 2003/2234 (2013.01); C08K 2003/2237 (2013.01); C08K 2003/2244 (2013.01); C08K 7/06 (2013.01); C08K 9/04 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); C08K 2201/011 (2013.01); C08L 2205/025 (2013.01); C08L 2207/04 (2013.01); C08L 2207/062 (2013.01);
Abstract

Parts made by additive manufacturing are often structural in nature, rather than having functional properties conveyed by a polymer or other component. Printed parts having piezoelectric properties may be formed using a composite filament comprising a plurality of piezoelectric particles dispersed in a thermoplastic polymer. The composite filaments may be formed through melt blending and extrusion. The composite filament is compatible with fused filament fabrication and has a length and diameter compatible with fused filament fabrication, and the piezoelectric particles are substantially non-agglomerated and dispersed along the length of the composite filament. The piezoelectric particles may remain substantially non-agglomerated when dispersed in the thermoplastic polymer through melt blending. Additive manufacturing processes may comprise heating such a composite filament at or above a melting point or softening temperature thereof to form a softened composite material, and depositing the softened composite material layer by layer to form a printed part.


Find Patent Forward Citations

Loading…