The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Jul. 29, 2021
Applicant:
The Japan Steel Works, Ltd., Tokyo, JP;
Inventors:
Assignee:
THE JAPAN STEEL WORKS, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14467 (2013.01); B29C 45/1418 (2013.01); B29C 45/14639 (2013.01); B29L 2031/3425 (2013.01);
Abstract
A molding method integrally molds thermoplastic resin and a flexible substrate mounted with a circuit and an electronic component on a flat plate having flexibility into a three-dimensional shape. The molding method includes the steps of determining an unfolded shape and circuit arrangement of the flexible substrate corresponding to the three-dimensional shape, elastically deforming and holding the flexible substrate along a resin filling space of a mold while the mold is being opened, and closing the mold and filling the resin filling space with thermoplastic resin.