The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Dec. 18, 2020
Applicant:

Arkema France, Colombes, FR;

Inventors:

Jérôme Pascal, Serquigny, FR;

Yves Deyrail, Serquigny, FR;

Philippe Bussi, Colombes, FR;

Clément Paul, Serquigny, FR;

Assignee:

ARKEMA FRANCE, Puteaux, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 43/00 (2006.01); B29C 43/52 (2006.01); C08G 65/40 (2006.01); B29K 71/00 (2006.01);
U.S. Cl.
CPC ...
B29C 43/003 (2013.01); B29C 43/52 (2013.01); C08G 65/4012 (2013.01); B29K 2071/00 (2013.01); B29K 2995/004 (2013.01); B29K 2995/0041 (2013.01); C08G 2250/00 (2013.01); C08G 2650/40 (2013.01);
Abstract

A process including: the provision of a semicrystalline or crystallizable composition, having a glass transition temperature T, including at least one polyaryletherketone; the provision of a compression forming means including: a mold, the mold having at least one cavity; the preparation of the composition in the molten state in said at least one cavity, the mold having a temperature Tat the end of the preparation stage; the compression and the cooling of the composition in the molten state, the mold being cooled from the temperature Tdown to a final temperature Tof less than or equal to (T+30)° C., to form a compression-formed article; and the removal of the compression-formed article from the mold; in which the composition has a melting point strictly of less than 340° C.


Find Patent Forward Citations

Loading…