The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Jun. 19, 2020
Applicant:

Siemens Industry Software Inc., Plano, TX (US);

Inventors:

Katharina Eissing, Papenburg, DE;

Omar Fergani, Berlin, DE;

Frank Heinrichsdorff, Teltow, DE;

Darya Kastsian, Falkensee, DE;

Daniel Reznik, Berlin, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/85 (2021.01); B22F 10/366 (2021.01); B22F 12/44 (2021.01); B22F 12/47 (2021.01); B33Y 50/02 (2015.01); G06F 30/27 (2020.01);
U.S. Cl.
CPC ...
B22F 10/85 (2021.01); B22F 10/366 (2021.01); B22F 12/44 (2021.01); B22F 12/47 (2021.01); B33Y 50/02 (2014.12);
Abstract

A computing system may include an access engine and a toolpath reordering engine. The access engine may be configured to access an original layer toolpath for slice of a 3D CAD object as well as a heat criticality measure for the original layer toolpath. The heat criticality measure may specify a heat impact for different points on the multiple toolpath segments of the original layer toolpath for the 3D printing of the physical part using the original layer toolpath. The toolpath reordering engine may be configured to reorder the multiple toolpath segments into a modified layer toolpath, and the modified layer toolpath may have a heat criticality measure with a lesser heat impact on the physical part than the heat criticality measure for the original layer toolpath.


Find Patent Forward Citations

Loading…