The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

May. 01, 2020
Applicant:

Tekna Plasma Systems Inc., Sherbrooke, CA;

Inventors:

Xavier Cauchy, Outremont, CA;

Hakim Rahma, Magog, CA;

Assignee:

Tekna Plasma Systems Inc., Sherbrooke, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/34 (2021.01); B22F 1/052 (2022.01); B22F 1/065 (2022.01); B22F 1/102 (2022.01); B22F 1/145 (2022.01); B22F 1/16 (2022.01); B22F 9/14 (2006.01); B22F 10/28 (2021.01); B22F 10/38 (2021.01); B22F 10/66 (2021.01); B22F 10/73 (2021.01); B22F 12/67 (2021.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); C22C 16/00 (2006.01); C22C 19/05 (2006.01); C22C 21/02 (2006.01); B22F 10/322 (2021.01); B22F 10/68 (2021.01); B22F 12/90 (2021.01); B33Y 30/00 (2015.01);
U.S. Cl.
CPC ...
B22F 1/065 (2022.01); B22F 1/052 (2022.01); B22F 1/102 (2022.01); B22F 1/145 (2022.01); B22F 9/14 (2013.01); B22F 10/28 (2021.01); B22F 10/38 (2021.01); B22F 10/66 (2021.01); B22F 10/73 (2021.01); B22F 12/67 (2021.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C22C 16/00 (2013.01); C22C 19/055 (2013.01); C22C 21/02 (2013.01); B22F 1/16 (2022.01); B22F 10/322 (2021.01); B22F 10/34 (2021.01); B22F 10/68 (2021.01); B22F 12/90 (2021.01); B22F 2301/052 (2013.01); B22F 2301/15 (2013.01); B22F 2301/205 (2013.01); B22F 2304/10 (2013.01); B33Y 30/00 (2014.12);
Abstract

In additive manufacturing operations, powders used in stereolithographic processes need to be precisely spread out in a uniform fashion at every pass of the stereolithographic process to ensure predictability in powder surface morphology. Typically, this is difficult to achieve with conventional powders because often these powders suffer from poor flowability, which may further deteriorate over time, and impairs the efficiency of the stereolithographic processes. The present disclosure describes additive manufacturing powders having improved physical characteristics such as flowability and tap density, which are less sensitive or insensitive to ambient humidity. For example, there is described a powder that includes spherical particles having a particle size distribution of less than 1000 micrometers and having a measurable flowability as determined in accordance with ASTM B213 at 75% relative humidity.


Find Patent Forward Citations

Loading…