The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Jul. 21, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jongsu Kim, Seongnam-si, KR;
Johnho Kuk, Osan-si, KR;
Sunil Park, Cedar Park, TX (US);
Kwangsung Lee, Yongin-si, KR;
Yoichiro Iwa, Suwon-si, KR;
Sewon Jeon, Hwaseong-si, KR;
Youngho Jung, Hwaseong-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
TSC Inc., Hwaseong-si, KR;
Abstract
A wafer polishing apparatus includes a base support; a polishing pad on the base support; a polishing head on an upper portion of the base support and configured to rotate; a polishing head support on the upper portion of the base support and connected to the polishing head, a retainer ring attached to a lower portion of the polishing head; an illumination device configured to provide light to at least a part of an inner surface of the retainer ring; and a camera device configured to capture an image of at least a part of the inner surface of the retainer ring while the polishing head rotates. The polishing head support may be configured to rotate on the base support such that the polishing head is on at least one of a treatment region or a maintenance region of the base support.