The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Mar. 04, 2025
Applicant:

Olympus Corporation, Hachioji, JP;

Inventor:

Tatsuya Higuchi, Yokohama, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 18/00 (2006.01); A61B 1/00 (2006.01); A61B 17/068 (2006.01); A61B 18/14 (2006.01); A61B 90/00 (2016.01);
U.S. Cl.
CPC ...
A61B 18/1445 (2013.01); A61B 1/00009 (2013.01); A61B 17/0682 (2013.01); A61B 90/39 (2016.02); A61B 2018/1452 (2013.01); A61B 2090/3908 (2016.02); A61B 2090/3991 (2016.02);
Abstract

In a full thickness resection using a medical stapler, when preprocessing of the resection, one may cauterize the peripheral tissues of the lesion site and perform the marking with a high-frequency treatment device to determine a guide of a region for the resection. However, when a planar marking is formed by cauterizing the peripheral tissues by a high-frequency treatment device, it may be difficult to visually recognize the marking in an endoscopic visual field. A lesion resection method can include forming a three-dimensional marking in peripheral tissues of a lesion; grasping the lesion by a grasping forceps; pulling the marking to a hand side of a staple ejection position of a stapler by pulling the grasping forceps grasping the lesion; ejecting a staple from the stapler to ligate the peripheral tissues of the lesion; and resecting the lesion.


Find Patent Forward Citations

Higuchi, Tatsuya. (2026). Lesion resection method (U.S. Patent No. 12521169). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12521169

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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