The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2026

Filed:

Sep. 20, 2021
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Mi Hyang Sheen, Anyang-si, KR;

Ki Young Yeon, Yongin-si, KR;

Do Hyung Kim, Cheonan-si, KR;

Kyung Lae Rho, Suwon-si, KR;

Na Ri Ahn, Seongnam-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/813 (2025.01); H01L 25/075 (2006.01); H10H 20/01 (2025.01); H10H 20/815 (2025.01); H10H 20/821 (2025.01);
U.S. Cl.
CPC ...
H10H 20/821 (2025.01); H01L 25/0753 (2013.01); H10H 20/01 (2025.01); H10H 20/815 (2025.01);
Abstract

A method of manufacturing a light-emitting element, and a light-emitting element array substrate and a display device including the same are provided. A method of manufacturing a light-emitting element includes: forming a base substrate including a plurality of protrusions and a rod area which is a remaining area except for the plurality of protrusions; forming a buffer layer on the base substrate; forming a semiconductor structure including a first semiconductor material layer, a light-emitting material layer, and a second semiconductor material layer on the buffer layer; forming a plurality of mask patterns overlapping the rod area on the semiconductor structure; forming element rods by removing the semiconductor structure overlapping the plurality of protrusions using the plurality of mask patterns; forming an insulating film around an outer surface of each of the element rods. and separating the element rods from the buffer layer.


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