The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2026

Filed:

Aug. 11, 2020
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Yuichi Nagahisa, Tokyo, JP;

Takanori Tanaka, Tokyo, JP;

Hiroyuki Amishiro, Tokyo, JP;

Naoyuki Kawabata, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 62/832 (2025.01); H10D 12/01 (2025.01); H10D 62/10 (2025.01);
U.S. Cl.
CPC ...
H10D 62/8325 (2025.01); H10D 12/031 (2025.01); H10D 62/106 (2025.01);
Abstract

A silicon carbide layer has an active region and an outer peripheral region arranged along an outer periphery of the active region in an in-plane direction. First well regions are arranged in the active region. A second well region is arranged in the outer peripheral region. Ohmic electrodes are arranged on a second surface of the silicon carbide layer, are connected to a source electrode, are electrically and ohmically connected to the first well regions, and have surface regions ohmically contacting a part forming the second surface of the silicon carbide layer and having a second conductivity type. The active region includes a standard region part and a thinned region part between the standard region part and the outer peripheral region. The surface regions are arranged at surface density lower in the thinned region part than in the standard region part in a plan view.


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