The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
May. 18, 2023
Applicant:
Unisantis Electronics Singapore Pte. Ltd., Singapore, SG;
Inventors:
Nozomu Harada, Tokyo, JP;
Kenichi Kanazawa, Tokyo, JP;
Assignee:
UNISANTIS ELECTRONICS SINGAPORE PTE. LTD., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 30/01 (2025.01); H10B 10/00 (2023.01); H10D 30/67 (2025.01);
U.S. Cl.
CPC ...
H10D 30/025 (2025.01); H10B 10/12 (2023.02); H10D 30/6735 (2025.01);
Abstract
Players which entirely cover top parts of Si pillars and which surround the Si pillars at equal widths in a plan view are formed by self-alignment with the Si pillars, W layers are formed on the Players, a band-shaped contact hole which is in contact with respective partial regions of the W layers and which extends in the Y direction is formed, and a supply wiring metal layer is formed by filling the band-shaped contact hole. The partial regions of the W layers are shaped so as to protrude to outside of the band-shaped contact hole in a plan view.