The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
Oct. 11, 2022
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Nobuyoshi Adachi, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;
Abstract
A semiconductor device is provided having a semiconductor substrate with a circuit layer provided on a first main surface of the semiconductor substrate. The circuit layer includes a first and second electrode layers with a dielectric layer disposed therebetween, a first outer electrode electrically connected to the first electrode layer and a second outer electrode electrically connected to the second electrode layer. When the circuit layer is viewed from above, the first electrode layer has a first facing portion facing the second electrode layer in the thickness direction and a first non-facing portion not facing the second electrode layer, and the second electrode layer has a second facing portion facing the first electrode layer in the thickness direction and a second non-facing portion not facing the first electrode layer.