The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2026

Filed:

Oct. 24, 2022
Applicant:

SK Hynix Inc., Gyeonggi-do, KR;

Inventors:

Ji Yeon Kim, Gyeonggi-do, KR;

Seung Hwan Kim, Gyeonggi-do, KR;

Assignee:

SK hynix Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H10B 12/30 (2023.02); H10B 12/03 (2023.02); H10B 12/05 (2023.02); H10B 12/482 (2023.02);
Abstract

A method for fabricating a semiconductor device includes: forming a stack body over a sacrificial pad; forming a sacrificial vertical structure that passes through the stack body to be coupled to the sacrificial pad; etching the stack body to form vertical openings spaced apart from the sacrificial vertical structure; forming a sacrificial recess that exposes a bottom portion of the sacrificial vertical structure by removing the sacrificial pad; forming an etch stop liner layer that surrounds the bottom portion of the sacrificial vertical structure; and selectively removing the sacrificial vertical structure.


Find Patent Forward Citations

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Kim, Ji. (2026). Semiconductor device having a three-dimensional structure and method for fabricating the same (U.S. Patent No. 12520480). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12520480

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