The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
Jan. 19, 2023
Nanya Technology Corporation, New Taipei, TW;
Wen-Chieh Wang, Taoyuan, TW;
NANYA TECHNOLOGY CORPORATION, New Taipei, TW;
Abstract
The present disclosure provides a method of manufacturing a semiconductor device. The method includes: sequentially forming a first supporting layer, a first mold layer, and a second supporting layer on a surface of a substrate; forming a plurality of first openings on the second supporting layer to expose the first mold layer; sequentially forming a second mold layer and a third supporting layer on the second supporting layer including the first openings; forming a plurality of second openings on the third supporting layer to expose the second mold layer; filling a mold material in the second openings; forming a plurality of trenches to expose the substrate, and the trenches are separated from the second openings; conformally forming a conductive layer on inner sidewalls of the trenches; and removing the mold material, the second mold layer, and the first mold layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile