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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12520464 B1

PDFFull Text
Date of Patent:
Jan. 06, 2026

Filed:

Jul. 16, 2019

Three-dimensional molding machine and component mounting machine

Applicant:

Fuji Corporation, Chiryu, JP;

Inventor:

Akihiro Kawajiri, Chiryu, JP;

Assignee:

FJUI CORPORATION, Chiryu, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Jamel M Nelson

Assistant Examiner:

Erica Hartsell Funk

Int. Cl.
CPC ...
B29C 64/112 (2017.01); B29C 64/236 (2017.01); B29C 64/245 (2017.01); H05K 3/10 (2006.01); H05K 3/12 (2006.01); H05K 13/00 (2006.01); H05K 13/04 (2006.01); B29L 31/34 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01);
U.S. Cl.
CPC ...
H05K 13/0061 (2013.01); B29C 64/112 (2017.08); B29C 64/236 (2017.08); B29C 64/245 (2017.08); H05K 3/10 (2013.01); H05K 3/125 (2013.01); H05K 13/0417 (2013.01); H05K 13/0452 (2013.01); H05K 13/0469 (2013.01); B29L 2031/3425 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12);
Abstract

A three-dimensional molding machine includes a three-dimensional molding device configured to mold a three-dimensional molded object on a molding pallet, a circuit forming device configured to form a circuit pattern on the molded object during or after molding, a component mounting device configured to mount an electronic component on the circuit pattern formed on the molded object, a pallet conveyance device configured to convey the molded object together with the molding pallet between the three-dimensional molding device, the circuit forming device, and the component mounting device, and a component conveyance device configured to the electronic components into the component mounting device from an outside of the machine.

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