The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2026

Filed:

May. 26, 2023
Applicant:

Nidec Corporation, Kyoto, JP;

Inventors:

Keisuke Kawata, Kyoto, JP;

Toshihiko Tokeshi, Kyoto, JP;

Takehito Tamaoka, Kyoto, JP;

Assignee:

NIDEC CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20272 (2013.01); G06F 1/20 (2013.01); H05K 7/20254 (2013.01); H05K 7/20263 (2013.01);
Abstract

A cooling assembly is connectable with a cold plate that comes into thermal contact with a heat source, and includes a first manifold, a second manifold, and a radiator. The first manifold causes a refrigerant having circulated through a first pipe to flow out from outflow ports toward the cold plate. In the second manifold, the refrigerant flowing into inflow ports from the cold plate circulates through a second pipe. In the radiator, the refrigerant having circulated through the second pipe circulates through the flow paths arranged side by side at intervals. Each of the first and second pipes opposes a portion of the radiator in the first direction.


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