The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
Jan. 21, 2022
Applicants:
Lx Semicon Co., Ltd., Daejeon, KR;
FJ Composite Materials Co., Ltd., Hokkaido, JP;
Inventors:
Assignees:
LX SEMICON CO., LTD., Daejeon, KR;
FJ COMPOSITE MATERIALS CO., LTD., Hokkaido, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/38 (2006.01); C23C 14/18 (2006.01); C23C 14/34 (2006.01); H05K 1/03 (2006.01); H05K 3/02 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 3/381 (2013.01); C23C 14/185 (2013.01); C23C 14/34 (2013.01); H05K 1/0306 (2013.01); H05K 3/022 (2013.01); H05K 3/06 (2013.01); H05K 3/388 (2013.01);
Abstract
This application relates to a method for manufacturing a printed circuit board. According to the present application, it is possible to manufacture a printed circuit board having excellent bonding strength between a ceramic substrate and a metal sheet, and the manufacturing cost thereof can be reduced.
Quick Actions:
Lee, Jun. (2026). Method for manufacturing printed circuit board (U.S. Patent No. 12520435). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12520435
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile