The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
May. 27, 2022
Yazaki Corporation, Tokyo, JP;
Satyabrata Raychaudhuri, Camarillo, CA (US);
YAZAKI CORPORATION, Tokyo, JP;
Abstract
A method of fabricating a connectivity panel comprises ejecting, by an ejection nozzle, electrically conductive material configured to flow along a path in a direction from the ejection nozzle to a substrate, and lasering, by a laser light emitter, a target location of the electrically conductive material to soften the electrically conductive material. The target location is sufficiently distant from the substrate to prevent heating the substrate by the lasering while allowing the softened electrically conductive material to harden as the softened electrically conductive material is deposited on the substrate. The method further includes maneuvering, by a mechanical mechanism, at least one of the ejection nozzle or a platform on which the substrate is placed to deposit a network of conductive pathways with the electrically conductive material on the substrate.