The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
May. 03, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Eun-Seok Hong, Suwon-si, KR;
Jungje Bang, Suwon-si, KR;
Kyungho Lee, Suwon-si, KR;
Hyunsung Hwang, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
An electronic device may include: a flexible printed circuit board having a flexible region and a support region and configured to be deformable in the flexible region; an antenna module facing the support region of the flexible printed circuit board; a solder ball for connecting the antenna module to the flexible printed circuit board; an underfill resin filled between the flexible printed circuit board and the antenna module in a liquid state and then solidified; and a solder wall for connecting the antenna module to the flexible printed circuit board and placed between the solder ball and the flexible region to block the flow of the underfill from the support region toward the flexible region before the underfill resin is solidified, and the solder wall has a width equal to or greater than the width of the flexible region. Various other embodiments are possible.