The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2026

Filed:

Nov. 06, 2023
Applicant:

Sii Printek Inc., Chiba, JP;

Inventor:

Kensuke Yoshida, Chiba, JP;

Assignee:

SII PRINTEK, INC., Chiba, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); B41J 2/045 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); B41J 2/04541 (2013.01); B41J 2/04548 (2013.01); B41J 2/04581 (2013.01); H05K 1/028 (2013.01);
Abstract

A flexible board includes a first and second wiring layers opposed to each other along a direction perpendicular to a board surface of the flexible board, at least one drive device arranged on the first wiring layer, an individual wiring region arranged in the first wiring layer, including a plurality of individual wiring lines, a common wiring region arranged in the second wiring layer, including at least one common wiring line, a pressure-bonding electrode part arranged closed to the jet section side than the individual wiring region and the common wiring region, including a plurality of pressure-bonding electrodes electrically coupled individually to the plurality of individual wiring lines and the at least one common wiring line, and an overlap region in which at least a part of the individual wiring region and at least a part of the common wiring region overlap each other in the board surface.


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