The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
May. 22, 2025
Next Silicon Ltd., Givatayim, IL;
Yehuda Mizrahi, Kfar Yona, IL;
NEXT SILICON LTD., Givatayim, IL;
Abstract
The present invention relates to the technological field of microelectronics and electronic engineering, specifically to advanced liquid-cooling-based thermal management systems for electronic components on printed circuit boards. The present invention represents a liquid cooling assembly that provides an improvement to the technological field of microelectronics and electronic engineering, by providing an effective cooling solution for systems employing vertical power delivery. Specifically, it provides liquid cooling for electronic components located on both sides of the PCB while fitting within the spatial constraints of modem electronic devices. The invention further provides a computing device that includes such an improved liquid cooling assembly, thereby improving the aforementioned technological field by increasing device operation efficiency, specifically enabling prolonged and stable operation in computationally intensive regimes due to highly efficient thermal management.