The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2026

Filed:

Jul. 20, 2022
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Yulin Huang, Moriguchi, JP;

Gong Bin Tang, Moriguchi, JP;

Kyohei Kobayashi, Otsu, JP;

Assignee:

SKYWORKS SOLUTIONS, INC., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 9/10 (2006.01); H03H 9/145 (2006.01); H03H 9/25 (2006.01); H03H 9/64 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02834 (2013.01); H03H 9/1064 (2013.01); H03H 9/14544 (2013.01); H03H 9/25 (2013.01); H03H 9/64 (2013.01);
Abstract

Embodiments of the invention relate to a surface acoustic wave device including a piezoelectric substrate, an interdigital transducer electrode on the piezoelectric substrate and a first thermally conductive layer arranged over the piezoelectric substrate and interdigital transducer electrode. The first thermally conductive layer is spaced apart from the piezoelectric substrate and interdigital transducer electrode. The surface acoustic wave device also includes a second thermally conductive layer configured to dissipate heat generated by the surface acoustic wave device. The second thermally conductive layer is arranged on an opposing side of the piezoelectric substrate to the interdigital transducer electrode. Related wafer-level packages, radio frequency modules and wireless communication devices are also provided.


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