The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2026

Filed:

Sep. 03, 2022
Applicant:

Smarter Microelectronics (Guang Zhou) Co., Ltd., Guangzhou, CN;

Inventors:

Qiang Su, Guangzhou, CN;

Yongle Li, Guangzhou, CN;

Limin Yu, Guangzhou, CN;

Baiming Xu, Guangzhou, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03F 3/195 (2006.01); H03F 1/56 (2006.01);
U.S. Cl.
CPC ...
H03F 3/195 (2013.01); H03F 1/565 (2013.01); H03F 2200/222 (2013.01); H03F 2200/451 (2013.01);
Abstract

When a signal source sends a radio-frequency signal to an input amplification circuit, a control circuit sends a first control signal to the input amplification circuit according to the frequency of the radio-frequency signal, the input amplification circuit receives the first control signal and forms an input oscillation loop, the radio-frequency signal forms an amplified first signal through the input oscillation loop, and the input amplification circuit sends the first signal to the output amplification circuit. According to the frequency of the radio-frequency signal, the control circuit transmits a second control signal to the output amplification circuit, which forms an output oscillation loop matched with the first signal. The first signal is amplified by the output oscillation loop to form an emitting signal, the output amplification circuit transmits the emitting signal to the emitting antenna for emitting, thereby improving the utilization ratio of a radio-frequency front end chip package.


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