The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2026

Filed:

Oct. 22, 2024
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventor:

Youngja Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 1/015 (2006.01); B23K 3/047 (2006.01); B23K 3/08 (2006.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B23K 1/0016 (2013.01); B23K 1/015 (2013.01); B23K 3/047 (2013.01); B23K 3/087 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01); B23K 2101/40 (2018.08); H01L 21/561 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/75272 (2013.01); H01L 2224/75804 (2013.01); H01L 2224/759 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75984 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/81092 (2013.01); H01L 2224/81095 (2013.01); H01L 2224/81211 (2013.01); H01L 2224/81395 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81908 (2013.01); H01L 2224/95092 (2013.01); H01L 2224/97 (2013.01); H01L 2924/014 (2013.01); H01L 2924/20104 (2013.01); H01L 2924/20105 (2013.01); H01L 2924/20106 (2013.01);
Abstract

A method of manufacturing an electronic device includes: providing a vapor generating chamber that accommodates a heat transfer fluid; providing a substrate stage within the vapor generating chamber, the substrate stage including a seating surface and suction passages penetrating the substrate stage to be open to the seating surface; loading a substrate on the substrate stage, wherein electronic components are disposed on the substrate via bumps; generating at least a partial vacuum in the suction holes to suction-support the substrate on the seating surface; heating the heat transfer fluid to generate saturated vapor within the vapor generating chamber; and soldering the bumps using the saturated vapor.


Find Patent Forward Citations

Quick Actions:

Kim, Youngja. (2026). Solder reflow apparatus and method of manufacturing an electronic device (U.S. Patent No. 12519077). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12519077

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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