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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12519070 B1

PDFFull Text
Date of Patent:
Jan. 06, 2026

Filed:

Dec. 27, 2022

System, electronic device and package with vertical to horizontal substrate integrated waveguide transition and horizontal grounded coplanar waveguide transition

Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Aditya Nitin Jogalekar, Dallas, TX (US);

Harshpreet Singh Phull Bakshi, Dallas, TX (US);

Rajen Manicon Murugan, Dallas, TX (US);

Sylvester Ankamah-Kusi, Dallas, TX (US);

Assignee:

TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);

Attorneys:

Ronald O. Neerings

Frank D. Cimino

Primary Examiner:

Reema Patel

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01P 3/00 (2006.01); H01P 3/12 (2006.01); H01P 5/107 (2006.01); H01P 11/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01P 3/003 (2013.01); H01P 3/121 (2013.01); H01P 5/107 (2013.01); H01P 11/002 (2013.01); H01P 11/003 (2013.01); H01L 2223/6633 (2013.01);
Abstract

An electronic device includes a multilevel package substrate with a horizontal substrate integrated waveguide (SIW) with a channel, a vertical SIW with an opening, a grounded coplanar waveguide (GCPW), a first transition between the horizontal SIW and the GCPW, and a second transition between the horizontal and vertical SIWs, as well as a semiconductor die having conductive structures coupled to a signal trace and a ground trace of the GCPW, and a package structure that encloses the semiconductor die and a portion of the multilevel package substrate.

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