The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
Apr. 25, 2023
Applicant:
Fuji Electric Co., Ltd., Kawasaki, JP;
Inventors:
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 23/492 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 2224/16221 (2013.01); H01L 2924/35121 (2013.01);
Abstract
A semiconductor device includes an insulated circuit substrate, a semiconductor chip, a printed circuit board, an interposer, and a sealing member, the interposer including a plurality of post electrodes each having one end bonded to the semiconductor chip via a solder layer, an insulating layer provided to be separately opposed to the semiconductor chip and provided with a first penetration hole filled with part of the solder layer, and a conductor layer provided to be opposed to the printed circuit board and connected to another end of each of the post electrodes via the insulating layer.