logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12519029 B1

PDFFull Text
Date of Patent:
Jan. 06, 2026

Filed:

Feb. 15, 2024

Three dimensional ic package with thermal enhancement

Applicant:

Google Llc, Mountain View, CA (US);

Inventors:

Woon-Seong Kwon, Santa Clara, CA (US);

Xiaojin Wei, Dublin, CA (US);

Madhusudan K. Iyengar, Foster City, CA (US);

Teckgyu Kang, Saratoga, CA (US);

Assignee:

Google LLC, Mountain View, CA (US);

Attorney:

Lerner David LLP

Primary Examiner:

Hung K Vu

Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/4882 (2013.01); H01L 23/49816 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 25/18 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1434 (2013.01);
Abstract

An IC die includes a temperature control element suitable for three-dimensional IC package with enhanced thermal control and management. The temperature control element may be formed as an integral part of an IC die that may assist temperature control of the IC die when in operation. The temperature control element may include a heat dissipation material disposed therein to assist dissipating thermal energy generated by the plurality of devices in the IC die during operation.

Find Patent Forward Citations

Kwon, Woon-Seong. (2026). Three dimensional ic package with thermal enhancement (U.S. Patent No. 12519029). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12519029

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…