The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
Feb. 16, 2023
Taiyo Yuden Co., Ltd., Tokyo, JP;
Keigo Nakamura, Takasaki, JP;
Michio Oshima, Takasaki, JP;
Shunya Fukuda, Takasaki, JP;
Jyouji Ariga, Takasaki, JP;
Yoshinori Shibata, Takasaki, JP;
Takashi Asai, Takasaki, JP;
TAIYO YUDEN CO., LTD., Tokyo, JP;
Abstract
A ceramic electronic device includes a multilayer chip having a plurality of dielectric layers and a plurality of internal electrode layers so as to face each other, each of the plurality of internal electrode layers being stacked via each of the plurality of dielectric layers, an external electrode that is provided on an end face of the multilayer chip, contacts each end of at least a part of the plurality of internal electrode layers, and includes a co-material, the end face being an end of the multilayer chip in a direction in which the plurality of internal electrode layers extend, and a projection portion that is provided between the external electrode and the multilayer chip and has a projection shape toward the external electrode from the multilayer chip. A main component of the projection portion is ceramic including at least Ba, Ca and Ti.