The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2026

Filed:

Dec. 17, 2024
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Chin-Lung Ting, Miao-Li County, TW;

Chung-Kuang Wei, Miao-Li County, TW;

Li-Wei Mao, Miao-Li County, TW;

Chi-Liang Chang, Miao-Li County, TW;

Chia-Hui Lin, Miao-Li County, TW;

Assignee:

InnoLux Corporation, Miao-Li County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G09F 9/302 (2006.01); G09G 3/32 (2016.01);
U.S. Cl.
CPC ...
G09F 9/3026 (2013.01); G09G 3/32 (2013.01); G09G 2300/026 (2013.01);
Abstract

An electronic device is provided and includes a substrate, a first bump, a second bump, and an electronic element. The substrate includes a first through hole and a second through hole disposed adjacent to the first through hole along a direction. The first bump and the second bump are overlapped with the substrate, wherein the first bump is adjacent to the second bump along the direction. The electronic element is overlapped with the substrate and electrically connected to the first bump, wherein the substrate is disposed between the first bump and the electronic element. A distance between the first through hole and the second through hole of the substrate along the direction is different from a distance between the first bump and the second bump along the direction.


Find Patent Forward Citations

Loading…