The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2026

Filed:

Feb. 02, 2021
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Kentaro Yoshida, Tokyo, JP;

Kei Hayashi, Tokyo, JP;

Fumio Wada, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2020.01); G01R 19/00 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2621 (2013.01); G01R 19/0092 (2013.01); H01L 23/5283 (2013.01);
Abstract

The object is to provide a technology for enabling reduction in the size of a semiconductor device. The semiconductor device includes a first semiconductor element and a second semiconductor element. An output of the first semiconductor element is connected to an output of the second semiconductor element through wiring. A main current flows through the first semiconductor element, and a sensing current flows through the second semiconductor element. The sensing current has a correlation with the main current. The semiconductor device further includes a current sensor. The current sensor senses the sensing current flowing through the second semiconductor element in a contactless manner.


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