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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12516190 B1

PDFFull Text
Date of Patent:
Jan. 06, 2026

Filed:

Jun. 23, 2021

Curable composition, urethane resin, and heat dissipation member

Applicant:

Sanyo Chemical Industries, Ltd., Kyoto, JP;

Inventors:

Shunsuke Ikeda, Kyoto, JP;

Tomoya Ohta, Kyoto, JP;

Ryo Yoshimoto, Kyoto, JP;

Koichi Mori, Kyoto, JP;

Assignee:

SANYO CHEMICAL INDUSTRIES, LTD., Kyoto, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Rabon A Sergent

Int. Cl.
CPC ...
C08L 75/04 (2006.01); C08G 18/22 (2006.01); C08G 18/38 (2006.01); C08G 18/40 (2006.01); C08G 18/42 (2006.01); C08G 18/44 (2006.01); C08G 18/48 (2006.01); C08G 18/50 (2006.01); C08G 18/66 (2006.01); C08G 18/75 (2006.01); C08G 18/79 (2006.01); C08K 3/08 (2006.01); C08K 3/22 (2006.01); C08K 3/26 (2006.01); C08K 3/28 (2006.01); C08K 5/103 (2006.01); C08K 5/523 (2006.01); C08K 7/18 (2006.01); C09K 5/14 (2006.01);
U.S. Cl.
CPC ...
C08L 75/04 (2013.01); C08G 18/227 (2013.01); C08G 18/3885 (2013.01); C08G 18/4018 (2013.01); C08G 18/42 (2013.01); C08G 18/44 (2013.01); C08G 18/4804 (2013.01); C08G 18/4808 (2013.01); C08G 18/4812 (2013.01); C08G 18/4825 (2013.01); C08G 18/4829 (2013.01); C08G 18/4833 (2013.01); C08G 18/4854 (2013.01); C08G 18/5084 (2013.01); C08G 18/66 (2013.01); C08G 18/6666 (2013.01); C08G 18/755 (2013.01); C08G 18/792 (2013.01); C08K 3/22 (2013.01); C08K 5/103 (2013.01); C08K 5/523 (2013.01); C08K 7/18 (2013.01); C09K 5/14 (2013.01); C08K 3/08 (2013.01); C08K 2003/222 (2013.01); C08K 2003/2227 (2013.01); C08K 3/26 (2013.01); C08K 3/28 (2013.01); C08K 2201/014 (2013.01);
Abstract

The present invention aims to provide a urethane resin and a heat dissipation component each having excellent thermal conductivity and excellent flexibility. The present invention relates to a curable composition containing: a polyol (A); a polyisocyanate (B); at least one dispersant (C) for inorganic fillers selected from the group consisting of a phosphate ester (C1), a C12-C24 fatty acid (C2), a sucrose fatty acid ester (C3), a sorbitan fatty acid ester (C4), and a glycerol fatty acid ester (C5); and an inorganic filler (D), the curable composition satisfying the following requirements (1) to (3) that (1) the polyol (A) contains a polyalkylene glycol (A1) having a chemical formula weight or number average molecular weight of 1000 or less in an amount of 50% by weight or more based on the weight of the polyol (A); (2) the inorganic filler (D) is contained in an amount of 70 to 97% by weight based on the weight of the curable composition; and (3) the total weight of the dispersant (C) for inorganic fillers is 1 to 5 parts by weight per 100 parts by weight of the inorganic filler (D), the phosphate ester (C1) being represented by the following formula (1):

Find Patent Forward Citations

Ikeda, Shunsuke. (2026). Curable composition, urethane resin, and heat dissipation member (U.S. Patent No. 12516190). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12516190

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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