The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2026

Filed:

Oct. 14, 2020
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Katrina P. Vizzini, Tacoma, WA (US);

Benjamin Lehman, Tacoma, WA (US);

Jonathan Hughes, Tacoma, WA (US);

Alfred P. Haro, Tacoma, WA (US);

Toshiya Kamae, Tacoma, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/32 (2006.01); C08G 59/38 (2006.01); C08G 59/40 (2006.01); C08G 59/68 (2006.01); C08J 5/24 (2006.01); C08K 5/5313 (2006.01);
U.S. Cl.
CPC ...
C08G 59/3227 (2013.01); C08G 59/38 (2013.01); C08G 59/4021 (2013.01); C08G 59/4064 (2013.01); C08G 59/686 (2013.01); C08J 5/249 (2021.05); C08K 5/5313 (2013.01); C08J 2363/02 (2013.01);
Abstract

This invention relates to a flame retardant epoxy resin composition which includes an epoxy resin structure having an epoxy functionality of 2 or more with a measured total heat release value of not more than 23 kJ/g as well as an organic phosphinic acid structure (in reacted or unreacted form), as well as a prepreg, and a fiber reinforced composite material prepared using the epoxy resin composition. More specifically, an epoxy resin composition is provided that contains a combination of particular types of epoxy resins and curatives that provide sufficient flame retardance when cured at 163° C. for 15 minutes. The epoxy resin systems are also suitable for preparing a fiber-reinforced composite material that will also provide sufficient flame retardance for a variety of applications.


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