The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
Aug. 09, 2022
Denso Corporation, Kariya, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota, JP;
Mirise Technologies Corporation, Nisshin, JP;
Katsuaki Goto, Nisshin, JP;
Shota Harada, Nisshin, JP;
Keitaro Ito, Nisshin, JP;
Yuuki Inagaki, Nisshin, JP;
Takahiko Yoshida, Nisshin, JP;
Yusuke Kawai, Nisshin, JP;
DENSO CORPORATION, Kariya, JP;
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota, JP;
MIRISE Technologies Corporation, Nisshin, JP;
Abstract
In a method for manufacturing a micro vibration body having a three-dimensional curved surface, a mold defining a recess part is prepared, and a plate-shaped reflow material is arranged on the mold so as to cover the recess part. Pressure of a space defined by the recess part covered with the reflow material is reduced, and the reflow material is deformed by heating from an upper surface side opposite to a lower surface facing the recess part and by means of the pressure reduced. When the reflow material is deformed, a part of the mold is heated and/or cooled. As another example, when the reflow material is deformed, a mold having a different heat capacity portion is used to generate a temperature gradient in the mold.