The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2026

Filed:

Sep. 10, 2020
Applicants:

Federico Ribet, Stockholm, SE;

Miku Brodin-laakso, Södertälje, SE;

Simone Pagliano, Stockholm, SE;

Frank Niklaus, Täby, SE;

Niclas Roxhed, Bromma, SE;

Göran Stemme, Lidingö, SE;

Inventors:

Federico Ribet, Stockholm, SE;

Miku Brodin-Laakso, Södertälje, SE;

Simone Pagliano, Stockholm, SE;

Frank Niklaus, Täby, SE;

Niclas Roxhed, Bromma, SE;

Göran Stemme, Lidingö, SE;

Assignee:

Sensible Holding B.V., JD Delft, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 3/00 (2006.01); B81C 99/00 (2010.01);
U.S. Cl.
CPC ...
B81C 3/004 (2013.01); B81C 99/002 (2013.01); B81C 2203/051 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15153 (2013.01);
Abstract

A method for assembling one or more microchips into respective holes in a substrate surface of a separate receiving substrate for microchip insertion that is out-of-plane in relation to the substrate surface. The microchips are placed on the substrate surface and moved by one or more magnetic fields affecting a ferromagnetic layer of each microchip so that the microchips become out-of-plane oriented in relation to the substrate surface and are assembled into the holes.


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