The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
Oct. 18, 2022
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Ganapathy Subramaniam Sivakumar, Allen, TX (US);
Chad Alan Mckay, St. Paul, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0058 (2013.01); B81C 1/00269 (2013.01); B81C 1/00285 (2013.01); B81B 2201/042 (2013.01); B81B 2203/0315 (2013.01); B81B 2207/012 (2013.01); B81B 2207/017 (2013.01); B81C 2203/0109 (2013.01); B81C 2203/0118 (2013.01); B81C 2203/019 (2013.01); B81C 2203/035 (2013.01); B81C 2203/036 (2013.01); B81C 2203/0707 (2013.01);
Abstract
In described examples, apparatus includes a first substrate that delimits a surface of a cavity and a bondline structure arranged along a periphery of the cavity, where the bondline structure extends from the first substrate, and the bondline structure configured to bond with an interposer arranged on a second substrate. The apparatus also includes a diffusion barrier on the first substrate, the diffusion barrier configured to contact the interposer and impede a contaminant against migrating from the bondline structure and entering the cavity.