The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2026

Filed:

Aug. 17, 2023
Applicant:

Vibrant Microsystems Inc., Cupertino, CA (US);

Inventors:

Joseph Doll, Bend, OR (US);

Sanjay Bhandari, Cupertino, CA (US);

Assignee:

Vibrant Microsystems Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H04R 3/00 (2006.01); H04R 7/04 (2006.01); H04R 19/02 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0006 (2013.01); B81C 1/00095 (2013.01); H04R 3/00 (2013.01); H04R 7/04 (2013.01); H04R 19/02 (2013.01); H04R 19/04 (2013.01); H04R 31/003 (2013.01); H04R 31/006 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/04 (2013.01); B81B 2207/015 (2013.01); B81B 2207/07 (2013.01); B81C 2201/0132 (2013.01); B81C 2203/0728 (2013.01); H04R 2201/003 (2013.01);
Abstract

A MEMS audio device includes a first wafer having a top with a first cavity and a bottom with a vent hole coupled to the first cavity, wherein the bottom having first contacts, a second wafer disposed upon the first wafer having a flexible material layer disposed above the first cavity, a third wafer disposed upon the second wafer having physical contacts coupled to the second wafer, wherein the third wafer includes a second cavity disposed above the flexible material layer, a wiring wafer disposed below the first wafer having a second vent hole coupled to the first cavity, wherein the wiring wafer having second contacts coupled to the first contacts, and wherein the flexible material layer forms a diaphragm for the MEMS audio device.


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