The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
Aug. 27, 2020
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Hiroyoshi Nakajima, Tokyo, JP;
Katsuyuki Motai, Tokyo, JP;
Yuka Tachikawa, Tokyo, JP;
Makoto Mizoshiri, Tokyo, JP;
Kazushi Sato, Tokyo, JP;
DAI NIPPON PRINTING CO., LTD., Tokyo, JP;
Abstract
A packaging material used for a bag for transporting of a silicon material is a laminate in which a first resin base, barrier, second resin base, resin, and sealant layers are laminated in that order. A resin layer indentation elastic modulus is smaller than an indentation elastic modulus of each of the first and second resin base layers by one or more orders of magnitude, a sealant layer indentation elastic modulus is smaller than a first resin base layer indentation elastic modulus of and a second resin base layer indentation elastic modulus by one or more orders of magnitude, and a difference between the first resin base layer indentation elastic modulus and the second resin base layer indentation elastic modulus is smaller than a difference between the second resin base layer indentation elastic modulus and the indentation elastic modulus of the resin layer.