The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2026

Filed:

Mar. 05, 2022
Applicant:

Obducat Ab, Lund, SE;

Inventor:
Assignee:

OBDUCAT AB, Lund, SE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 59/00 (2006.01); B29C 59/02 (2006.01); B29K 23/00 (2006.01); B29K 25/00 (2006.01); B29K 67/00 (2006.01); B29K 69/00 (2006.01); B29K 105/00 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
B29C 59/002 (2013.01); B29C 59/026 (2013.01); G03F 7/0002 (2013.01); B29K 2023/38 (2013.01); B29K 2025/06 (2013.01); B29K 2067/003 (2013.01); B29K 2069/00 (2013.01); B29K 2105/0085 (2013.01); B29K 2995/0012 (2013.01); B29K 2995/0077 (2013.01);
Abstract

A method for facilitating demolding of a substrate from an imprint template, the method comprising: providing (S) the template and the substrate in a sandwich arrangement with a structured surface of the template in contact with a target surface of the substrate; applying heat (S) to soften a molding layer on the target surface, wherein said molding layer is a thermoplastic material having a minimum glass transition temperature, T>50° C. and Young's modulus>1000 MPa, and wherein the molding layer is heated above T; pressing (S) the sandwich arrangement together to imprint a pattern of the structured surface into the heated molding layer; submerging (S) the sandwich arrangement in a cooling liquid to harden the molding layer; and separating (S) the template from the patterned substrate.


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