The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
Feb. 06, 2019
Zeon Corporation, Tokyo, JP;
Masaru Kitagawa, Tokyo, JP;
ZEON CORPORATION, Tokyo, JP;
Abstract
A method for producing a dip-molded article, including a dip-molding step of dip-molding a latex composition containing a latex of a carboxyl group-containing conjugated diene-based rubber (A) and a water-soluble metal compound (B) using a dip mold to form a dip-molded layer on the surface of the dip mold; a moisture content adjustment step of adjusting the moisture content of the dip-molded layer formed on the surface of the dip mold to 1 to 30 wt %; and a beading step of performing beading after the adjusting of the moisture content, the beading including peeling a portion of the dip-molded layer formed on the surface of the dip mold from the dip mold.