The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2025
Filed:
Jul. 06, 2021
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Koichi Sejima, Kanagawa, JP;
Takashi Fukatani, Kumamoto, JP;
Kenya Nishio, Kanagawa, JP;
Masaki Haneda, Kanagawa, JP;
Nobutoshi Fujii, Kanagawa, JP;
Suguru Saito, Kanagawa, JP;
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Abstract
Provided is a semiconductor device with a wiring layer including a plurality of wiring lines extending in a first direction; a first insulating film stacked on the wiring layer that has a gap region between the plurality of wiring lines adjacent to each other in a second direction; and a second insulating film between the plurality of wiring lines and the first insulating film. Each wiring line includes a metal film and a barrier metal layer. The metal film includes an electrically conductive material including a first metal. The barrier metal layer partially covers surroundings of the metal film in a cross section orthogonal to the first direction and includes a material including a second metal. The second metal prevents diffusion of the first metal. The second insulating film includes an insulating material and covers a portion of the metal film. The insulating material prevents diffusion of the first metal.