The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2025
Filed:
Jan. 20, 2023
Shanghai Tianma Micro-electronics Co., Ltd., Shanghai, CN;
Akira Fujita, Kanagawa, JP;
Futoshi Nakanishi, Kanagawa, JP;
Shingo Saigou, Kanagawa, JP;
Nobuya Seko, Kanagawa, JP;
Shanghai Tianma Micro-Electronics Co., Ltd., Shanghai, CN;
Abstract
An optical device package includes a glass substrate, a warpage reducing film, a redistribution layer, and a semiconductor element. The warpage reducing film is disposed directly or indirectly on the glass substrate. The redistribution layer includes a wiring sublayer and an insulating sublayer. The wiring sublayer and the insulating sublayer are at least partially disposed on the warpage reducing film. The semiconductor element is mounted on the redistribution layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile