The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2025

Filed:

Jan. 19, 2024
Applicant:

Huawei Technologies Co., Ltd., Guangdong, CN;

Inventors:

Jun Luo, Wuhan, CN;

Zengguang Guo, Wuhan, CN;

Xiaokang Xiao, Dongguan, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G02B 6/42 (2006.01); H05K 3/28 (2006.01); H05K 5/06 (2006.01);
U.S. Cl.
CPC ...
H05K 5/069 (2013.01); G02B 6/4248 (2013.01); H05K 1/028 (2013.01); H05K 3/284 (2013.01);
Abstract

An electrical lead-out structure is used for hermetic package. The electrical lead-out structure includes a flexible circuit board and a packaging layer. The flexible circuit board includes an electrical signal layer and a reinforcing layer that are stacked up. The reinforcing layer is provided with a window that passes through the reinforcing layer. The electrical signal layer is adjacent to the window. The packaging layer fills the window, and a side that is of the packaging layer and that faces the electrical signal layer is insulatingly adjacent to the electrical signal layer. The packaging layer is disposed on the flexible circuit board, so that in the electrical lead-out structure, a feed-through area used for soldering to a hermetic housing is formed.


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