The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2025
Filed:
Oct. 04, 2022
Applicant:
Skyworks Solutions, Inc., Irvine, CA (US);
Inventors:
Guofeng Chen, Fremont, CA (US);
You Qian, Singapore, SG;
Rakesh Kumar, Singapore, SG;
Michael Jon Wurtz, Lake Oswego, OR (US);
Humberto Campanella-Pineda, Singapore, SG;
Assignee:
SKYWORKS SOLUTIONS, INC., Irvine, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 17/02 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); H04R 31/00 (2006.01); H10N 30/30 (2023.01);
U.S. Cl.
CPC ...
H04R 17/02 (2013.01); B81B 3/0021 (2013.01); B81C 1/00182 (2013.01); H04R 31/00 (2013.01); H10N 30/308 (2023.02); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0163 (2013.01); B81B 2203/0307 (2013.01); B81B 2203/0315 (2013.01); B81B 2203/04 (2013.01); B81C 2201/0132 (2013.01); B81C 2201/016 (2013.01); B81C 2201/017 (2013.01); B81C 2201/0176 (2013.01); H04R 2201/003 (2013.01);
Abstract
A piezoelectric microelectromechanical systems microphone is provided comprising a substrate including at least one wall defining a cavity, the at least one wall defining an anchor region around a perimeter, a piezoelectric film layer forming a membrane, the piezoelectric film layer being supported at the anchor region by a spring region, and an electrode disposed over the piezoelectric film layer. A method of manufacturing such a MEMS microphone is also provided.