The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2025

Filed:

Mar. 23, 2023
Applicants:

Te Connectivity Solutions Gmbh, Schaffhausen, CH;

Te Connectivity Belgium Bv, Oostkamp, BE;

Tyco Electronics Holdings (Bermuda) No. 7 Limited, Hamilton, BM;

Inventors:

Lieven Decrock, Oostkamp, BE;

Michael Rosier, Middletown, PA (US);

Josh Jiang, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/00 (2006.01); H01R 13/24 (2006.01); H01R 13/6473 (2011.01);
U.S. Cl.
CPC ...
H01R 13/6473 (2013.01); H01R 13/2407 (2013.01);
Abstract

An impedance matching structure for a high-speed connector includes a pair of ground leads, a differential pair of signal leads, a ground plane, a first region in which the ground leads and the differential pair of signal leads are coplanar within a first plane, and a second region in which the differential pair of signal leads lies on the first plane and the ground plane lies on a second plane extending along the first plane. The impedance matching structure has a transition region between the first region and the second region. The ground leads are connected to the ground plane in the transition region. An impedance matching projection is arranged in the transition region and projects from a side of the differential pair of signal leads.


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