The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2025

Filed:

Mar. 25, 2021
Applicant:

Smart Packaging Solutions, Rousset, FR;

Inventors:

Cécile Carrier, Rousset, FR;

Maxime Di Bernardo, Rousset, FR;

Kevin Fabrizio, Rousset, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); G06K 19/07 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/573 (2013.01); G06K 19/0723 (2013.01); H01L 23/49855 (2013.01); H01L 23/3121 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48227 (2013.01);
Abstract

The invention relates to an electronic module () intended to be held in place on a carrier () by a holding means (), the electronic module () consisting of a plurality of layers, comprising a first carrier layer () carrying one or more contacts (), a first face () of the carrier layer () is in contact with a first face () of a substrate () and comprising a face of the substrate () carrying one or more antennas (), the antenna(s) () being connected to an integrated circuit () via feeder links (). The electronic module () comprises at least one stay-in-place safety layer () arranged between the first carrier layer () and the substrate (), the safety layer () being an adhesive layer, the safety layer () having technical features such that the binding forces Fadof the layer are lower than the binding forces Fadof the holding means () so as to cause the rupture of the feeder links () by the action of a tensile force exerted on the electronic module.


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