The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2025
Filed:
Dec. 04, 2020
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/45 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/552 (2006.01); H03F 1/52 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/3107 (2013.01); H01L 23/49513 (2013.01); H01L 23/4952 (2013.01); H03F 1/523 (2013.01); H03F 3/45269 (2013.01); H03F 3/45273 (2013.01); H03F 2200/114 (2013.01);
Abstract
A semiconductor device includes a semiconductor chip that has a main surface, a device region that is demarcated at the main surface, a differential amplifier that is formed in the device region and that amplifies and outputs a differential signal input to the differential amplifier, an insulation layer that covers the device region on the main surface, and a shield electrode that is incorporated in the insulation layer such as to conceal the device region in a plan view and that is fixed to a ground potential.