The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2025

Filed:

Aug. 31, 2022
Applicant:

Diodes Incorporated, Plano, TX (US);

Inventors:

Li-Ju Huang, Plano, TX (US);

Michael Yimin Zhang, Dallas, TX (US);

Assignee:

DIODES INCORPORATED, Plano, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 21/4842 (2013.01); H01L 23/49575 (2013.01); H01L 24/06 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 25/0655 (2013.01); H01L 2224/0615 (2013.01); H01L 2224/48108 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/49171 (2013.01);
Abstract

A leadframe includes a peripheral frame, a plurality of lead pads, and a die attach pad (DAP). Each lead pad is physically connected to the peripheral frame by a respective connecting portion. The DAP is surrounded by the plurality of lead pads. The DAP includes a first protruding portion coupled to a first lead pad on a first side of the DAP and a second protruding portion coupled to a second lead pad on a second side of the DAP opposite the first side. The DAP does not comprise direct connections to the peripheral frame. The leadframe further includes two or more of the lead pads disposed on either side of the first lead pad on the first side of the DAP; and two or more of the lead pads disposed on either side of the second lead pad on the second side of the DAP.


Find Patent Forward Citations

Loading…