The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2025
Filed:
Aug. 31, 2021
Applicant:
Fuji Electric Co., Ltd., Kawasaki, JP;
Inventor:
Takashi Katsuki, Kawasaki, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H10D 62/83 (2025.01); H10D 62/832 (2025.01); H10D 62/85 (2025.01);
U.S. Cl.
CPC ...
H01L 23/3142 (2013.01); H01L 21/561 (2013.01); H01L 23/296 (2013.01); H01L 24/48 (2013.01); H10D 62/8303 (2025.01); H10D 62/8325 (2025.01); H10D 62/8503 (2025.01); H01L 2224/48245 (2013.01); H01L 2924/183 (2013.01); H01L 2924/186 (2013.01); H01L 2924/35121 (2013.01);
Abstract
A semiconductor module includes a semiconductor element made of a wide-bandgap semiconductor, the semiconductor element having an upper surface with an edge, a buffer member that covers the edge of the upper surface of the semiconductor element, and a sealing resin that seals the semiconductor element and the buffer member. The buffer member has a thickness equal to or larger than 50 μm.