The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2025

Filed:

Sep. 10, 2021
Applicant:

Mit Semiconductor (Tian Jin) Co., Ltd., Tianjin, CN;

Inventors:

Kim Mone Kwong, Singapore, SG;

Siong Huat Neo, Singapore, SG;

Kok Yeow Lim, Singapore, SG;

Zhi Qiang Mao, Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67271 (2013.01); H01L 21/67144 (2013.01); H01L 21/681 (2013.01); H01L 21/6838 (2013.01);
Abstract

A system for sorting a number of dies from a wafer is provided. The system includes a first wafer table for holding a first wafer frame having the plurality of dies, wherein the first wafer table is inclined at a first angle with respect to a horizontal plane; a second wafer table to accept a plurality of dies, wherein the second wafer table is placed parallel to the horizontal plane; and a rotary turret having a plurality of heads to simultaneously pick, retain and place dies, and is positioned between the first wafer table and the second wafer table, wherein the rotary turret is inclined at a second angle with respect to the horizontal plane. Further, a process for sorting a number of dies from the wafer is also provided.


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