The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2025

Filed:

Apr. 17, 2024
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Daisuke Hamada, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01);
Abstract

An electronic component includes first solid solution layer in which a first metal component as a primary component defining a solid solution with a second metal component is located at an interface with a dielectric layer in an end region nearer than a position that is about 5% or more and about 20% or less of a length-direction distance or about 10 μm or more and about 50 μm or less from an end surface of an extended portion of the inner electrode layer to the end surface, and a second solid solution layer in which the first metal component defining a solid solution with the second metal component and with a higher concentration than a concentration in the first solid solution layer is located at an interface with the dielectric layer in a central region of the facing portion in a length direction and a width direction.


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